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e.MMC 5.1 Client Storage

The Micron e.MMC 5.1 storage device delivers ultra-low power consumption to enable flexible OEM designs that provide a enduring and productive user experience for value-focused platforms.

eMMC 5.1

World’s first e.MMC device with 176-layer NAND1

The Micron e.MMC 5.1 flash storage device is the world’s first e.MMC built with Micron’s 176-layer NAND. This advanced NAND and feature set have led to broad qualifications across the industry.

The tiny footprint of Micron’s e.MMC storage provides client OEMs with unprecedented design flexibility — enabling more robust battery and graphics designs that provide the optimal user experience for Chromebook and other value-focused client platforms.

Benefits

Facilitates exceptional usable battery life

The Micron e.MMC 5.1 uses up to 95% less power during active use2 and 99% less power during sleep mode3 than other client SSD form factors. Extended battery life and performance make for an exceptional user experience.

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Promotes creative designs that meet a diverse set of use cases

Unlike SSDs with M.2 form factors, there is no socket necessary for the Micron e.MMC. Its very thin 0.8mm z-height and 11.5x13.0mm profile allows 77% more PCB area than the smallest M.2 SSDs.4 The Micron e.MMC profile frees up space for more design flexibility in client devices.

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Provides a proven standard that is ideal for applications with entry-level storage requirements

The Micron e.MMC 5.1 storage device provides a proven solution for devices requiring up to 128GB of storage and does not require the additional capabilities of UFS devices.

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1 Based on a survey of public material at the time of this document’s publication.
2 The active-mode power consumption comparison: e.MMC → VCCQM x ICCQM = 1.8V x 155mA = 279mW (max); 2450 M.2 SSD → 5500mW (max); (5500 - 279)/5500 = 95%
3 The sleep-mode power consumption comparison: e.MMC → VCCQM x ICCQM = 1.8V x 1µA = 0.0018mW ; 2450 M.2 SSD → 3mW (max); (3 - 0.0018)/3 = 99.94%
4 The “77% more PCB area” statement is due to the Micron e.MMC package's areal footprint of 149.5mm2 calculated from its 11.5 x-dimension and its 13.0 y-dimension and comparing the same areal footprint of 660mm2 calculated from the package x and y dimensions found in the M.2 22x30 specification (see http://www.snia.org/forums/cmsi/knowledge/formfactors#M2 for M.2 22x30 dimensions); (660-149.5)/660 = 77%

Density

Select Density
  • 2GB
  • 4GB
  • 8GB
  • 16GB
  • 32GB
  • 64GB
  • 128GB
Range: 2GB - 128GB
  • Width
    x8
  • Voltage
    3.3V
  • Package
    WFBGA
  • MMC Interface
    4.41
  • Op. Temp.
    -25C to +85C
  • Width
    x8
  • Voltage
    2.7V-3.6V
  • Package
    LBGA, TBGA, TFBGA, VFBGA
  • MMC Interface
    4.4, 4.5, 5.0
  • Op. Temp.
    -25C to +85C, -40C to +85C
  • Width
    x8
  • Voltage
    2.7V-3.6V, 3.3V
  • Package
    LBGA, LFBGA, TBGA, TFBGA, VFBGA
  • MMC Interface
    4.5, 5.0
  • Op. Temp.
    -25C to +85C, -40C to +85C, -40C to +105C
  • Width
    x8
  • Voltage
    2.7V-3.6V, 3.3V
  • Package
    LBGA, LFBGA, TBGA, TFBGA, VFBGA
  • MMC Interface
    4.4, 4.5, 5.0
  • Op. Temp.
    -25C to +85C, -40C to +85C, -40C to +105C
  • Width
    x8
  • Voltage
    2.7V-3.6V, 3.3V
  • Package
    LBGA, LFBGA, TBGA, TFBGA, VFBGA
  • MMC Interface
    4.4, 4.5, 5.0
  • Op. Temp.
    -25C to +85C, -40C to +85C, -40C to +105C
  • Width
    x8
  • Voltage
    2.7V-3.6V, 3.3V
  • Package
    LBGA, LFBGA
  • MMC Interface
    5.0
  • Op. Temp.
    -25C to +85C, -40C to +85C, -40C to +105C
  • Width
    x8
  • Voltage
    3.3V
  • Package
    LFBGA
  • MMC Interface
    5.0
  • Op. Temp.
    40C to +85C
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